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Electrical Characteristics
| Access Time-Max | 70 |
| Additional Feature | TOP BOOT BLOCK |
| Alternate Memory Width | 8 |
| JESD-30 Code | R-PBGA-B48 |
| JESD-609 Code | e0 |
| Length | 9 |
| Memory Density | 8388608 |
| Memory IC Type | FLASH |
| Memory Width | 16 |
| Number of Functions | 1 |
| Number of Terminals | 48 |
| Number of Words | 524288 |
| Number of Words Code | 512K |
| Operating Mode | ASYNCHRONOUS |
| Operating Temperature-Max | 85 |
| Operating Temperature-Min | -40 |
| Organization | 512KX16 |
| Package Body Material | PLASTIC/EPOXY |
| Package Code | TFBGA |
| Package Shape | RECTANGULAR |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Programming Voltage | 3 |
| Qualification Status | Not Qualified |
| Seated Height-Max | 1.2 |
| Supply Voltage-Max (Vsup) | 3.6 |
| Supply Voltage-Min (Vsup) | 2.7 |
| Supply Voltage-Nom (Vsup) | 3 |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | TIN LEAD |
| Terminal Form | BALL |
| Terminal Pitch | 0.8 |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Width | 6 |