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Ordering Info
In Stock: 0
MOQ: 260
Package Quantity: 260
COO: CN
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*Product Country of Origin (COO) information may be unavailable at the time of order placement. Buyer acknowledges that additional duties, tariffs, or import fees may be assessed based on the actual COO once determined.
| Quantity | Cost |
|---|---|
| 260 | - |
Electrical Characteristics
| JESD-30 Code | S-PBGA-B71 |
| Length | 9 |
| Moisture Sensitivity Level | 3 |
| Number of Terminals | 71 |
| Operating Temperature-Max | 85 |
| Operating Temperature-Min | -40 |
| Package Body Material | PLASTIC/EPOXY |
| Package Code | VFLGA |
| Package Shape | SQUARE |
| Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| Peak Reflow Temperature (Cel) | 250 |
| Qualification Status | Not Qualified |
| Seated Height-Max | 1 |
| Supply Voltage-Max | 3.4 |
| Supply Voltage-Min | 2 |
| Supply Voltage-Nom | 2.7 |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Form | BUTT |
| Terminal Pitch | 0.5 |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Width | 9 |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT |