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Electrical Characteristics
| Family | LV/LV-A/LVX/H |
| JESD-30 Code | R-PDSO-G14 |
| JESD-609 Code | e4 |
| Length | 5 |
| Load Capacitance (CL) | 50 |
| Logic IC Type | BUFFER |
| Max I(ol) | 0.004 |
| Moisture Sensitivity Level | 1 |
| Number of Functions | 6 |
| Number of Inputs | 1 |
| Number of Terminals | 14 |
| Operating Temperature-Max | 85 |
| Operating Temperature-Min | -40 |
| Package Body Material | PLASTIC/EPOXY |
| Package Code | TSSOP |
| Package Equivalence Code | TSSOP14,.25 |
| Package Shape | RECTANGULAR |
| Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| Packing Method | TAPE AND REEL |
| Peak Reflow Temperature (Cel) | 260 |
| Power Supplies | 3.3 |
| Prop Delay@Nom-Sup | 11.5 |
| Propagation Delay (tpd) | 16 |
| Qualification Status | Not Qualified |
| Schmitt Trigger | NO |
| Seated Height-Max | 1.2 |
| Sub Category | Gates |
| Supply Voltage-Max (Vsup) | 3.6 |
| Supply Voltage-Min (Vsup) | 2 |
| Supply Voltage-Nom (Vsup) | 2.7 |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | Nickel/Palladium/Gold (Ni/Pd/Au) |
| Terminal Form | GULL WING |
| Terminal Pitch | 0.65 |
| Terminal Position | DUAL |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Width | 4.4 |