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Learn more about ECAD Model here.Electrical Characteristics
| Family | AHC/VHC |
| JESD-30 Code | R-PDSO-G5 |
| JESD-609 Code | e3 |
| Length | 3 |
| Logic IC Type | NAND GATE |
| Max I(ol) | 0.008 |
| Moisture Sensitivity Level | 1 |
| Number of Functions | 1 |
| Number of Inputs | 2 |
| Number of Terminals | 5 |
| Operating Temperature-Max | 125 |
| Operating Temperature-Min | -55 |
| Package Body Material | PLASTIC/EPOXY |
| Package Code | TSSOP |
| Package Equivalence Code | TSOP5/6,.11,37 |
| Package Shape | RECTANGULAR |
| Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| Packing Method | TAPE AND REEL |
| Peak Reflow Temperature (Cel) | 260 |
| Power Supplies | 2/5.5 |
| Prop Delay@Nom-Sup | 10 |
| Propagation Delay (tpd) | 15.5 |
| Qualification Status | Not Qualified |
| Schmitt Trigger | NO |
| Seated Height-Max | 1.1 |
| Sub Category | Gates |
| Supply Voltage-Max (Vsup) | 5.5 |
| Supply Voltage-Min (Vsup) | 2 |
| Supply Voltage-Nom (Vsup) | 3.3 |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | MILITARY |
| Terminal Finish | Tin (Sn) |
| Terminal Form | GULL WING |
| Terminal Pitch | 0.95 |
| Terminal Position | DUAL |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Width | 1.5 |