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MC9S08SH16MTG | NXP

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NXP MC9S08SH16MTG


RoHS Compliant

Ordering Info

In Stock: 0

MOQ: 1

Package Quantity: 1

COO: CN

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Electrical Characteristics

ADC Channels YES
Address Bus Width 0
Bit Size 8
Clock Frequency-Max 40
DAC Channels NO
DMA Channels NO
External Data Bus Width 0
JESD-30 Code R-PDSO-G16
JESD-609 Code e3
Length 5
Moisture Sensitivity Level 3
Number of I/O Lines 14
Number of Terminals 16
Operating Temperature-Max 125
Operating Temperature-Min -40
PWM Channels YES
Package Body Material PLASTIC/EPOXY
Package Code TSSOP
Package Equivalence Code TSSOP16,.25
Package Shape RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) 260
Power Supplies 3/5
Qualification Status Not Qualified
RAM (bytes) 1024
ROM (words) 16384
ROM Programmability FLASH
Screening Level AEC-Q100
Seated Height-Max 1.2
Speed 40
Sub Category Microcontrollers
Supply Voltage-Max 5.5
Supply Voltage-Min 2.7
Supply Voltage-Nom 3
Surface Mount YES
Technology CMOS
Temperature Grade AUTOMOTIVE
Terminal Finish MATTE TIN
Terminal Form GULL WING
Terminal Pitch .65
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) 40
Width 4.4
uPs/uCs/Peripheral ICs Type MICROCONTROLLER