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MCF5272CVF66 | NXP

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NXP MCF5272CVF66

MCF5272 V2CORE 4KSRAM, 196 MAPBGA


RoHS Compliant

Ordering Info

In Stock: 0

MOQ: 630

Package Quantity: 630

Quantity Cost
630 -

Electrical Characteristics

Address Bus Width 23
Bit Size 32
Boundary Scan YES
Clock Frequency-Max 66
External Data Bus Width 32
Format FIXED POINT
Integrated Cache YES
JESD-30 Code S-PBGA-B196
Length 15
Low Power Mode YES
Moisture Sensitivity Level 3
Number of Terminals 196
Operating Temperature-Max 85
Operating Temperature-Min -40
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape SQUARE
Package Style GRID ARRAY
Peak Reflow Temperature (Cel) 220
Qualification Status Not Qualified
Seated Height-Max 1.75
Speed 66
Supply Voltage-Max 3.6
Supply Voltage-Min 3
Supply Voltage-Nom 3.3
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Form BALL
Terminal Pitch 1
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 15
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC