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MCF5272CVF66 | NXP

NXP MCF5272CVF66

MCF5272 V2CORE 4KSRAM, 196 MAPBGA


RoHS Compliant

Ordering Info

In Stock: 0

MOQ: 630

Package Quantity: 630

Subject to tariff fees.

*Product Country of Origin (COO) information may be unavailable at the time of order placement. Buyer acknowledges that additional duties, tariffs, or import fees may be assessed based on the actual COO once determined.

Quantity Cost
630 -

Electrical Characteristics

Address Bus Width 23
Bit Size 32
Boundary Scan YES
Clock Frequency-Max 66
External Data Bus Width 32
Format FIXED POINT
Integrated Cache YES
JESD-30 Code S-PBGA-B196
Length 15
Low Power Mode YES
Moisture Sensitivity Level 3
Number of Terminals 196
Operating Temperature-Max 85
Operating Temperature-Min -40
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape SQUARE
Package Style GRID ARRAY
Peak Reflow Temperature (Cel) 220
Qualification Status Not Qualified
Seated Height-Max 1.75
Speed 66
Supply Voltage-Max 3.6
Supply Voltage-Min 3
Supply Voltage-Nom 3.3
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Form BALL
Terminal Pitch 1
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 15
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC