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Ordering Info
In Stock: 0
MOQ: 90
Package Quantity: 90
HTS Code: 8542.31.00
ECCN: EAR99
COO: MY
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| Quantity | Cost |
|---|---|
| 90 | - |
Electrical Characteristics
| Additional Feature | ALSO REQUIRES 3.3 V I/O SUPPLY |
| Address Bus Width | 26 |
| Bit Size | 32 |
| Boundary Scan | YES |
| Clock Frequency-Max | 24 |
| External Data Bus Width | 16 |
| Format | FIXED POINT |
| Integrated Cache | YES |
| JESD-30 Code | S-PBGA-B400 |
| Length | 17 |
| Low Power Mode | YES |
| Moisture Sensitivity Level | 3 |
| Number of Terminals | 400 |
| Operating Temperature-Max | 85 |
| Operating Temperature-Min | -40 |
| Package Body Material | PLASTIC/EPOXY |
| Package Code | LFBGA |
| Package Equivalence Code | BGA400,20X20,32 |
| Package Shape | SQUARE |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH |
| Peak Reflow Temperature (Cel) | 260 |
| Power Supplies | 1.2/1.5,1.8/3.3 |
| Qualification Status | Not Qualified |
| Seated Height-Max | 1.6 |
| Speed | 400 |
| Sub Category | Microprocessors |
| Supply Voltage-Max | 1.52 |
| Supply Voltage-Min | 1.38 |
| Supply Voltage-Nom | 1.45 |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | Tin/Silver/Copper - with Nickel barrier |
| Terminal Form | BALL |
| Terminal Pitch | .8 |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Width | 17 |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR |