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MCIMX257CJM4A | NXP

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NXP MCIMX257CJM4A

i.MX257: Multimedia Applications Processors - ARM9™ Core


Ordering Info

In Stock: 0

MOQ: 90

Package Quantity: 90

HTS Code: 8542.31.00

ECCN: EAR99

COO: MY

Quantity Cost
90 -

Electrical Characteristics

Additional Feature ALSO REQUIRES 3.3 V I/O SUPPLY
Address Bus Width 26
Bit Size 32
Boundary Scan YES
Clock Frequency-Max 24
External Data Bus Width 16
Format FIXED POINT
Integrated Cache YES
JESD-30 Code S-PBGA-B400
Length 17
Low Power Mode YES
Moisture Sensitivity Level 3
Number of Terminals 400
Operating Temperature-Max 85
Operating Temperature-Min -40
Package Body Material PLASTIC/EPOXY
Package Code LFBGA
Package Equivalence Code BGA400,20X20,32
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260
Power Supplies 1.2/1.5,1.8/3.3
Qualification Status Not Qualified
Seated Height-Max 1.6
Speed 400
Sub Category Microprocessors
Supply Voltage-Max 1.52
Supply Voltage-Min 1.38
Supply Voltage-Nom 1.45
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish Tin/Silver/Copper - with Nickel barrier
Terminal Form BALL
Terminal Pitch .8
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 40
Width 17
uPs/uCs/Peripheral ICs Type MICROPROCESSOR