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Ordering Info
In Stock: 0
MOQ: 260
Package Quantity: 260
Subject to tariff fees.
*Product Country of Origin (COO) information may be unavailable at the time of order placement. Buyer acknowledges that additional duties, tariffs, or import fees may be assessed based on the actual COO once determined.
| Quantity | Cost |
|---|---|
| 260 | - |
Electrical Characteristics
| Address Bus Width | 16 |
| Boundary Scan | YES |
| External Data Bus Width | 16 |
| Format | FIXED POINT |
| Integrated Cache | YES |
| JESD-30 Code | S-PBGA-B272 |
| Length | 9 |
| Low Power Mode | YES |
| Moisture Sensitivity Level | 3 |
| Number of Terminals | 272 |
| Package Body Material | PLASTIC/EPOXY |
| Package Code | LFBGA |
| Package Shape | SQUARE |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH |
| Peak Reflow Temperature (Cel) | 260 |
| Seated Height-Max | 1.23 |
| Speed | 528 |
| Surface Mount | YES |
| Technology | CMOS |
| Terminal Form | BALL |
| Terminal Pitch | 0.5 |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Width | 9 |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR |