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Ordering Info
In Stock: 0
Package Quantity: 60
HTS Code: 8542.31.00
ECCN: EAR99
COO: CN
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*Product Country of Origin (COO) information may be unavailable at the time of order placement. Buyer acknowledges that additional duties, tariffs, or import fees may be assessed based on the actual COO once determined.
| Quantity | Cost |
|---|---|
| - |
Electrical Characteristics
| Address Bus Width | 16 |
| Bit Size | 64 |
| Boundary Scan | YES |
| Clock Frequency-Max | 24 |
| External Data Bus Width | 64 |
| Format | FIXED POINT |
| Integrated Cache | YES |
| JESD-30 Code | S-PBGA-B624 |
| JESD-609 Code | e1 |
| Length | 21 |
| Low Power Mode | YES |
| Moisture Sensitivity Level | 3 |
| Number of Terminals | 624 |
| Package Body Material | PLASTIC/EPOXY |
| Package Code | HBGA |
| Package Shape | SQUARE |
| Package Style | GRID ARRAY, HEAT SINK/SLUG |
| Peak Reflow Temperature (Cel) | 260 |
| Seated Height-Max | 1.6 |
| Speed | 1000 |
| Supply Voltage-Max | 1.5 |
| Supply Voltage-Min | 1.35 |
| Surface Mount | YES |
| Technology | CMOS |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| Terminal Form | BALL |
| Terminal Pitch | .8 |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Width | 21 |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR |