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MCIMX6S6AVM08AD | NXP

NXP MCIMX6S6AVM08AD


Ordering Info

In Stock: 0

Package Quantity: 1

COO: CN

Subject to tariff fees.

*Product Country of Origin (COO) information may be unavailable at the time of order placement. Buyer acknowledges that additional duties, tariffs, or import fees may be assessed based on the actual COO once determined.

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Electrical Characteristics

Additional Feature 24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE
Address Bus Width 16
Boundary Scan YES
External Data Bus Width 32
Format FLOATING POINT
Integrated Cache YES
JESD-30 Code S-PBGA-B624
Length 21
Low Power Mode YES
Number of Terminals 624
Operating Temperature-Max 125
Operating Temperature-Min -40
Package Body Material PLASTIC/EPOXY
Package Code LFBGA
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED
Seated Height-Max 1.6
Speed 800
Supply Voltage-Max 1.5
Supply Voltage-Min 1.275
Surface Mount YES
Technology CMOS
Temperature Grade AUTOMOTIVE
Terminal Form BALL
Terminal Pitch .8
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 21
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC