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MCIMX6X2CVN08AB | NXP

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NXP MCIMX6X2CVN08AB

i.MX6SX Series 3.15 V 800 MHz Surface Mount Dual Core Processor - MAPBGA-400


RoHS Compliant

Ordering Info

In Stock: 0

MOQ: 90

Package Quantity: 90

Quantity Cost
90 -

Electrical Characteristics

Address Bus Width 15
Boundary Scan YES
External Data Bus Width 32
Format FLOATING POINT
Integrated Cache YES
JESD-30 Code S-PBGA-B400
JESD-609 Code e1
Length 17
Low Power Mode YES
Moisture Sensitivity Level 3
Number of Terminals 400
Package Body Material PLASTIC/EPOXY
Package Code LFBGA
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260
Seated Height-Max 1.53
Speed 800
Supply Voltage-Max 1.5
Supply Voltage-Min 1.275
Surface Mount YES
Technology CMOS
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 0.8
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 40
Width 17
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC