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Ordering Info
In Stock: 0
MOQ: 90
Package Quantity: 90
COO: CN
Subject to tariff fees.
*Product Country of Origin (COO) information may be unavailable at the time of order placement. Buyer acknowledges that additional duties, tariffs, or import fees may be assessed based on the actual COO once determined.
| Quantity | Cost |
|---|---|
| 90 | - |
Electrical Characteristics
| Address Bus Width | 15 |
| Boundary Scan | YES |
| External Data Bus Width | 32 |
| Format | FLOATING POINT |
| Integrated Cache | YES |
| JESD-30 Code | S-PBGA-B400 |
| JESD-609 Code | e1 |
| Length | 17 |
| Low Power Mode | YES |
| Moisture Sensitivity Level | 3 |
| Number of Terminals | 400 |
| Package Body Material | PLASTIC/EPOXY |
| Package Code | LFBGA |
| Package Shape | SQUARE |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH |
| Peak Reflow Temperature (Cel) | 260 |
| Seated Height-Max | 1.53 |
| Speed | 800 |
| Supply Voltage-Max | 1.5 |
| Supply Voltage-Min | 1.275 |
| Surface Mount | YES |
| Technology | CMOS |
| Terminal Finish | TIN SILVER COPPER |
| Terminal Form | BALL |
| Terminal Pitch | 0.8 |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Width | 17 |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |