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Ordering Info
In Stock: 0
MOQ: 9
Package Quantity: 1
COO: CN
Subject to tariff fees.
*Product Country of Origin (COO) information may be unavailable at the time of order placement. Buyer acknowledges that additional duties, tariffs, or import fees may be assessed based on the actual COO once determined.
| Quantity | Cost |
|---|---|
| 9 | - |
Electrical Characteristics
| Additional Feature | SEATED-HGT CALCULATED |
| Address Bus Width | 16 |
| Bit Size | 32 |
| Boundary Scan | YES |
| External Data Bus Width | 32 |
| Format | FLOATING POINT |
| Integrated Cache | YES |
| JESD-30 Code | S-PBGA-B541 |
| Length | 19 |
| Low Power Mode | YES |
| Moisture Sensitivity Level | 3 |
| Number of Terminals | 541 |
| Operating Temperature-Max | 105 |
| Operating Temperature-Min | -20 |
| Package Body Material | PLASTIC/EPOXY |
| Package Code | LFBGA |
| Package Shape | SQUARE |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Seated Height-Max | 1.42 |
| Speed | 800 |
| Supply Voltage-Max | 1.155 |
| Supply Voltage-Min | .95 |
| Supply Voltage-Nom | 1 |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | OTHER |
| Terminal Form | BALL |
| Terminal Pitch | .75 |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Width | 19 |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |