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Learn more about ECAD Model here.Electrical Characteristics
Additional Feature | SEATED-HGT CALCULATED |
Address Bus Width | 16 |
Bit Size | 32 |
Boundary Scan | YES |
External Data Bus Width | 32 |
Format | FLOATING POINT |
Integrated Cache | YES |
JESD-30 Code | S-PBGA-B541 |
Length | 19 |
Low Power Mode | YES |
Moisture Sensitivity Level | 3 |
Number of Terminals | 541 |
Operating Temperature-Max | 105 |
Operating Temperature-Min | -20 |
Package Body Material | PLASTIC/EPOXY |
Package Code | LFBGA |
Package Shape | SQUARE |
Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Seated Height-Max | 1.42 |
Speed | 800 |
Supply Voltage-Max | 1.155 |
Supply Voltage-Min | .95 |
Supply Voltage-Nom | 1 |
Surface Mount | YES |
Technology | CMOS |
Temperature Grade | OTHER |
Terminal Form | BALL |
Terminal Pitch | .75 |
Terminal Position | BOTTOM |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Width | 19 |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |