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Learn more about ECAD Model here.Electrical Characteristics
| Family | HC/UH |
| JESD-30 Code | R-PDSO-G14 |
| JESD-609 Code | e3 |
| Length | 8.6235 |
| Load Capacitance (CL) | 50 |
| Logic IC Type | OR GATE |
| Max I(ol) | 0.004 |
| Moisture Sensitivity Level | 1 |
| Number of Functions | 4 |
| Number of Inputs | 2 |
| Number of Terminals | 14 |
| Operating Temperature-Max | 85 |
| Operating Temperature-Min | -40 |
| Package Body Material | PLASTIC/EPOXY |
| Package Code | SOP |
| Package Equivalence Code | SOP14,.25 |
| Package Shape | RECTANGULAR |
| Package Style | SMALL OUTLINE |
| Packing Method | RAIL |
| Peak Reflow Temperature (Cel) | 260 |
| Power Supplies | 42772 |
| Prop Delay@Nom-Sup | 25 |
| Propagation Delay (tpd) | 125 |
| Qualification Status | Not Qualified |
| Schmitt Trigger | NO |
| Seated Height-Max | 1.753 |
| Sub Category | Gates |
| Supply Voltage-Max (Vsup) | 6 |
| Supply Voltage-Min (Vsup) | 2 |
| Supply Voltage-Nom (Vsup) | 4.5 |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | Matte Tin (Sn) |
| Terminal Form | GULL WING |
| Terminal Pitch | 1.27 |
| Terminal Position | DUAL |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Width | 3.9 |