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Learn more about ECAD Model here.NXP MPC5554MZP132
Ordering Info
In Stock: 0
Package Quantity: 1
HTS Code: 8542.31.0001
ECCN: 3A991A2
COO: CN
Subject to tariff fees.
Quantity | Cost |
---|---|
- |
Electrical Characteristics
ADC Channels | YES |
Additional Feature | IT ALSO REQUIRES 3.3V SUPPLY |
Address Bus Width | 24 |
Bit Size | 32 |
Clock Frequency-Max | 20 |
DAC Channels | NO |
DMA Channels | NO |
External Data Bus Width | 32 |
JESD-30 Code | S-PBGA-B416 |
JESD-609 Code | e0 |
Length | 27 |
Moisture Sensitivity Level | 3 |
Number of Terminals | 416 |
Operating Temperature-Max | 125 |
Operating Temperature-Min | -40 |
PWM Channels | YES |
Package Body Material | PLASTIC/EPOXY |
Package Code | HBGA |
Package Equivalence Code | BGA416,26X26,40 |
Package Shape | SQUARE |
Package Style | GRID ARRAY, HEAT SINK/SLUG |
Peak Reflow Temperature (Cel) | 245 |
Power Supplies | 1.5,3.3,5 |
Qualification Status | Not Qualified |
RAM (bytes) | 65536 |
ROM (words) | 2097152 |
ROM Programmability | FLASH |
Seated Height-Max | 2.55 |
Speed | 132 |
Sub Category | Microcontrollers |
Supply Current-Max | 600 |
Supply Voltage-Max | 1.65 |
Supply Voltage-Min | 1.35 |
Supply Voltage-Nom | 1.5 |
Surface Mount | YES |
Technology | CMOS |
Temperature Grade | AUTOMOTIVE |
Terminal Finish | TIN LEAD |
Terminal Form | BALL |
Terminal Pitch | 1 |
Terminal Position | BOTTOM |
Time@Peak Reflow Temperature-Max (s) | 40 |
Width | 27 |
uPs/uCs/Peripheral ICs Type | MICROCONTROLLER |