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MPC5554MZP132 | NXP

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NXP MPC5554MZP132


Ordering Info

In Stock: 0

Package Quantity: 1

HTS Code: 8542.31.0001

ECCN: 3A991A2

COO: CN

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Quantity Cost
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Electrical Characteristics

ADC Channels YES
Additional Feature IT ALSO REQUIRES 3.3V SUPPLY
Address Bus Width 24
Bit Size 32
Clock Frequency-Max 20
DAC Channels NO
DMA Channels NO
External Data Bus Width 32
JESD-30 Code S-PBGA-B416
JESD-609 Code e0
Length 27
Moisture Sensitivity Level 3
Number of Terminals 416
Operating Temperature-Max 125
Operating Temperature-Min -40
PWM Channels YES
Package Body Material PLASTIC/EPOXY
Package Code HBGA
Package Equivalence Code BGA416,26X26,40
Package Shape SQUARE
Package Style GRID ARRAY, HEAT SINK/SLUG
Peak Reflow Temperature (Cel) 245
Power Supplies 1.5,3.3,5
Qualification Status Not Qualified
RAM (bytes) 65536
ROM (words) 2097152
ROM Programmability FLASH
Seated Height-Max 2.55
Speed 132
Sub Category Microcontrollers
Supply Current-Max 600
Supply Voltage-Max 1.65
Supply Voltage-Min 1.35
Supply Voltage-Nom 1.5
Surface Mount YES
Technology CMOS
Temperature Grade AUTOMOTIVE
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 40
Width 27
uPs/uCs/Peripheral ICs Type MICROCONTROLLER