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MPC8270VVQLDA | NXP

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NXP MPC8270VVQLDA


RoHS Compliant

Ordering Info

In Stock: 0

MOQ: 21

Package Quantity: 21

COO: CN

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Quantity Cost
21 -

Electrical Characteristics

Additional Feature ALSO REQUIRES 3.3V SUPPLY
Address Bus Width 32
Bit Size 32
Boundary Scan YES
Clock Frequency-Max 83.33
External Data Bus Width 64
Format FLOATING POINT
Integrated Cache YES
JESD-30 Code S-PBGA-B480
JESD-609 Code e1
Length 37.5
Low Power Mode NO
Moisture Sensitivity Level 4
Number of Terminals 480
Operating Temperature-Max 70
Operating Temperature-Min 0
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Equivalence Code BGA480,29X29,50
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 260
Power Supplies 1.5,3.3
Qualification Status Not Qualified
Seated Height-Max 1.65
Speed 333
Sub Category Other uPs/uCs/Peripheral ICs
Supply Voltage-Max 1.6
Supply Voltage-Min 1.45
Supply Voltage-Nom 1.5
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Pitch 1.27
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 40
Width 37.5
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC