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Electrical Characteristics
| Bit Size | 32 |
| JESD-30 Code | S-PBGA-B516 |
| JESD-609 Code | e2 |
| Moisture Sensitivity Level | 3 |
| Number of Terminals | 516 |
| Operating Temperature-Max | 105 |
| Operating Temperature-Min | 0 |
| Package Body Material | PLASTIC/EPOXY |
| Package Code | BGA |
| Package Equivalence Code | BGA516,26X26,40 |
| Package Shape | SQUARE |
| Package Style | GRID ARRAY |
| Peak Reflow Temperature (Cel) | 260 |
| Power Supplies | 1,1.8/2.5,3.3 |
| Qualification Status | Not Qualified |
| Speed | 400 |
| Sub Category | Microprocessors |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | OTHER |
| Terminal Finish | TIN COPPER/TIN SILVER |
| Terminal Form | BALL |
| Terminal Pitch | 1 |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |