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NXP MPC855TCVR50D4
PBGA 357/ 32 BIT POWERQUICC INTEGRATED COMMUNICATIONS PROCESSOR / 12NC: 935
Ordering Info
In Stock: 0
MOQ: 44
Package Quantity: 44
COO: CN
Subject to tariff fees.
*Product Country of Origin (COO) information may be unavailable at the time of order placement. Buyer acknowledges that additional duties, tariffs, or import fees may be assessed based on the actual COO once determined.
| Quantity | Cost |
|---|---|
| 44 | - |
Electrical Characteristics
| Address Bus Width | 32 |
| Bit Size | 32 |
| Boundary Scan | YES |
| Clock Frequency-Max | 50 |
| External Data Bus Width | 32 |
| Format | FIXED POINT |
| Integrated Cache | YES |
| JESD-30 Code | S-PBGA-B357 |
| JESD-609 Code | e1 |
| Length | 25 |
| Low Power Mode | YES |
| Moisture Sensitivity Level | 3 |
| Number of Terminals | 357 |
| Package Body Material | PLASTIC/EPOXY |
| Package Code | BGA |
| Package Equivalence Code | BGA357,19X19,50 |
| Package Shape | SQUARE |
| Package Style | GRID ARRAY |
| Peak Reflow Temperature (Cel) | 245 |
| Power Supplies | 3.3 |
| Qualification Status | Not Qualified |
| Seated Height-Max | 2.52 |
| Speed | 50 |
| Sub Category | Microprocessors |
| Supply Voltage-Max | 3.465 |
| Supply Voltage-Min | 3.135 |
| Supply Voltage-Nom | 3.3 |
| Surface Mount | YES |
| Technology | CMOS |
| Terminal Finish | TIN SILVER COPPER |
| Terminal Form | BALL |
| Terminal Pitch | 1.27 |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Width | 25 |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |