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MPC860TVR50D4 | NXP

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NXP MPC860TVR50D4


Ordering Info

In Stock: 0

MOQ: 44

Package Quantity: 44

COO: CN

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Quantity Cost
44 -

Electrical Characteristics

Address Bus Width 32
Bit Size 32
Boundary Scan YES
Clock Frequency-Max 50
External Data Bus Width 32
Format FIXED POINT
Integrated Cache YES
JESD-30 Code S-PBGA-B357
JESD-609 Code e1
Length 25
Low Power Mode YES
Moisture Sensitivity Level 3
Number of Terminals 357
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA357,19X19,50
Package Shape SQUARE
Package Style GRID ARRAY
Peak Reflow Temperature (Cel) 245
Power Supplies 3.3
Qualification Status Not Qualified
Seated Height-Max 2.52
Speed 50
Sub Category Microprocessors
Supply Voltage-Max 3.465
Supply Voltage-Min 3.135
Supply Voltage-Nom 3.3
Surface Mount YES
Technology CMOS
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Pitch 1.27
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 25
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC