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Ordering Info
In Stock: 0
MOQ: 44
Package Quantity: 44
COO: CN
Subject to tariff fees.
Quantity | Cost |
---|---|
44 | - |
Electrical Characteristics
Address Bus Width | 32 |
Bit Size | 32 |
Boundary Scan | YES |
Clock Frequency-Max | 50 |
External Data Bus Width | 32 |
Format | FIXED POINT |
Integrated Cache | YES |
JESD-30 Code | S-PBGA-B357 |
JESD-609 Code | e1 |
Length | 25 |
Low Power Mode | YES |
Moisture Sensitivity Level | 3 |
Number of Terminals | 357 |
Package Body Material | PLASTIC/EPOXY |
Package Code | BGA |
Package Equivalence Code | BGA357,19X19,50 |
Package Shape | SQUARE |
Package Style | GRID ARRAY |
Peak Reflow Temperature (Cel) | 245 |
Power Supplies | 3.3 |
Qualification Status | Not Qualified |
Seated Height-Max | 2.52 |
Speed | 50 |
Sub Category | Microprocessors |
Supply Voltage-Max | 3.465 |
Supply Voltage-Min | 3.135 |
Supply Voltage-Nom | 3.3 |
Surface Mount | YES |
Technology | CMOS |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
Terminal Form | BALL |
Terminal Pitch | 1.27 |
Terminal Position | BOTTOM |
Time@Peak Reflow Temperature-Max (s) | 30 |
Width | 25 |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |