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Learn more about ECAD Model here.Electrical Characteristics
| Address Bus Width | 32 |
| Bit Size | 32 |
| Boundary Scan | YES |
| External Data Bus Width | 32 |
| Format | FIXED POINT |
| Integrated Cache | YES |
| JESD-30 Code | S-PBGA-B357 |
| JESD-609 Code | e1 |
| Length | 25 |
| Low Power Mode | YES |
| Moisture Sensitivity Level | 3 |
| Number of Terminals | 357 |
| Package Body Material | PLASTIC/EPOXY |
| Package Code | BGA |
| Package Equivalence Code | BGA357,19X19,50 |
| Package Shape | SQUARE |
| Package Style | GRID ARRAY |
| Peak Reflow Temperature (Cel) | 245 |
| Power Supplies | 1.8,3.3 |
| Qualification Status | Not Qualified |
| Seated Height-Max | 2.52 |
| Speed | 133 |
| Sub Category | Microprocessors |
| Supply Voltage-Max | 1.9 |
| Supply Voltage-Min | 1.7 |
| Supply Voltage-Nom | 1.8 |
| Surface Mount | YES |
| Technology | CMOS |
| Terminal Finish | TIN SILVER COPPER |
| Terminal Form | BALL |
| Terminal Pitch | 1.27 |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Width | 25 |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |