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Package Quantity: 0
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| Quantity | Cost |
|---|---|
| - |
Electrical Characteristics
| JESD-30 Code | R-PBGA-B100 |
| JESD-609 Code | e1 |
| Length | 18 |
| Memory Density | 34359738368 |
| Memory IC Type | FLASH |
| Memory Width | 8 |
| Number of Functions | 1 |
| Number of Terminals | 100 |
| Number of Words | 4294967296 |
| Number of Words Code | 4G |
| Operating Mode | SYNCHRONOUS |
| Operating Temperature-Max | 85 |
| Operating Temperature-Min | -40 |
| Organization | 4GX8 |
| Package Body Material | PLASTIC/EPOXY |
| Package Code | VBGA |
| Package Shape | RECTANGULAR |
| Package Style | GRID ARRAY, VERY THIN PROFILE |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Cel) | 260 |
| Programming Voltage | 2.7 |
| Seated Height-Max | 1 |
| Supply Voltage-Max (Vsup) | 3.6 |
| Supply Voltage-Min (Vsup) | 2.7 |
| Supply Voltage-Nom (Vsup) | 3.3 |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| Terminal Form | BALL |
| Terminal Pitch | 1 |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Width | 12 |