Request Quote
Request Quote
Thank you for your inquiry. We are working on your request and will respond as soon as possible. For immediate inquiries please call 1-866-651-2901
Download the free Library Loader to convert this file for your ECAD Tool.
Learn more about ECAD Model here.Electrical Characteristics
Access Mode | MULTI BANK PAGE BURST |
Access Time-Max | 0.225 |
Additional Feature | AUTO/SELF REFRESH |
Clock Frequency-Max (fCLK) | 800 |
I/O Type | COMMON |
Interleaved Burst Length | 8 |
JESD-30 Code | R-PBGA-B96 |
JESD-609 Code | e1 |
Length | 14 |
Memory Density | 2147483648 |
Memory IC Type | DDR DRAM |
Memory Width | 16 |
Number of Functions | 1 |
Number of Ports | 1 |
Number of Terminals | 96 |
Number of Words | 134217728 |
Number of Words Code | 128M |
Operating Mode | SYNCHRONOUS |
Operating Temperature-Max | 95 |
Operating Temperature-Min | 0 |
Organization | 128MX16 |
Output Characteristics | 3-STATE |
Package Body Material | PLASTIC/EPOXY |
Package Code | TFBGA |
Package Equivalence Code | BGA96,9X16,32 |
Package Shape | RECTANGULAR |
Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH |
Peak Reflow Temperature (Cel) | 260 |
Power Supplies | 1.35 |
Qualification Status | Not Qualified |
Refresh Cycles | 8192 |
Seated Height-Max | 1.2 |
Sequential Burst Length | 8 |
Standby Current-Max | 0.012 |
Sub Category | DRAMs |
Supply Current-Max | 0.195 |
Supply Voltage-Max (Vsup) | 1.45 |
Supply Voltage-Min (Vsup) | 1.283 |
Supply Voltage-Nom (Vsup) | 1.35 |
Surface Mount | YES |
Technology | CMOS |
Temperature Grade | OTHER |
Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
Terminal Form | BALL |
Terminal Pitch | 0.8 |
Terminal Position | BOTTOM |
Time@Peak Reflow Temperature-Max (s) | 30 |
Width | 8 |