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Learn more about ECAD Model here.Electrical Characteristics
| Access Time-Max | 6 |
| Clock Frequency-Max (fCLK) | 133 |
| I/O Type | COMMON |
| Interleaved Burst Length | 2,4,8 |
| JESD-30 Code | R-PBGA-B90 |
| JESD-609 Code | e3 |
| Memory Density | 1073741824 |
| Memory IC Type | DDR DRAM |
| Memory Width | 32 |
| Moisture Sensitivity Level | 1 |
| Number of Terminals | 90 |
| Number of Words | 33554432 |
| Number of Words Code | 32M |
| Operating Temperature-Max | 85 |
| Operating Temperature-Min | -40 |
| Organization | 32MX32 |
| Output Characteristics | 3-STATE |
| Package Body Material | PLASTIC/EPOXY |
| Package Code | FBGA |
| Package Equivalence Code | BGA90,9X15,32 |
| Package Shape | RECTANGULAR |
| Package Style | GRID ARRAY, FINE PITCH |
| Peak Reflow Temperature (Cel) | 260 |
| Power Supplies | 1.8 |
| Qualification Status | Not Qualified |
| Refresh Cycles | 8192 |
| Sequential Burst Length | 2,4,8 |
| Standby Current-Max | 0.0006 |
| Sub Category | DRAMs |
| Supply Current-Max | 0.14 |
| Supply Voltage-Nom (Vsup) | 1.8 |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | MATTE TIN |
| Terminal Form | BALL |
| Terminal Pitch | 0.8 |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | 30 |