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Learn more about ECAD Model here.Electrical Characteristics
Access Mode | FOUR BANK PAGE BURST |
Access Time-Max | 5.4 |
Additional Feature | AUTO/SELF REFRESH |
Clock Frequency-Max (fCLK) | 143 |
I/O Type | COMMON |
Interleaved Burst Length | 1,2,4,8 |
JESD-30 Code | R-PBGA-B60 |
JESD-609 Code | e0 |
Length | 16 |
Memory Density | 268435456 |
Memory IC Type | SYNCHRONOUS DRAM |
Memory Width | 8 |
Number of Functions | 1 |
Number of Ports | 1 |
Number of Terminals | 60 |
Number of Words | 33554432 |
Number of Words Code | 32M |
Operating Mode | SYNCHRONOUS |
Operating Temperature-Max | 70 |
Operating Temperature-Min | 0 |
Organization | 32MX8 |
Output Characteristics | 3-STATE |
Package Body Material | PLASTIC/EPOXY |
Package Code | TFBGA |
Package Equivalence Code | BGA60,8X15,32 |
Package Shape | RECTANGULAR |
Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH |
Peak Reflow Temperature (Cel) | 235 |
Power Supplies | 3.3 |
Qualification Status | Not Qualified |
Refresh Cycles | 8192 |
Seated Height-Max | 1.2 |
Sequential Burst Length | 1,2,4,8,FP |
Standby Current-Max | 0.002 |
Sub Category | DRAMs |
Supply Current-Max | 0.285 |
Supply Voltage-Max (Vsup) | 3.6 |
Supply Voltage-Min (Vsup) | 3 |
Supply Voltage-Nom (Vsup) | 3.3 |
Surface Mount | YES |
Technology | CMOS |
Temperature Grade | COMMERCIAL |
Terminal Finish | Tin/Lead (Sn/Pb) |
Terminal Form | BALL |
Terminal Pitch | 0.8 |
Terminal Position | BOTTOM |
Time@Peak Reflow Temperature-Max (s) | 30 |
Width | 8 |