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Electrical Characteristics
| Access Mode | MULTI BANK PAGE BURST |
| Access Time-Max | 20 |
| Additional Feature | AUTO REFRESH |
| Clock Frequency-Max (fCLK) | 400 |
| I/O Type | COMMON |
| JESD-30 Code | R-PBGA-B144 |
| JESD-609 Code | e0 |
| Length | 18.5 |
| Memory Density | 603979776 |
| Memory IC Type | DDR DRAM |
| Memory Width | 18 |
| Number of Functions | 1 |
| Number of Ports | 1 |
| Number of Terminals | 144 |
| Number of Words | 33554432 |
| Number of Words Code | 32M |
| Operating Mode | SYNCHRONOUS |
| Operating Temperature-Max | 95 |
| Operating Temperature-Min | 0 |
| Organization | 32MX18 |
| Output Characteristics | 3-STATE |
| Package Body Material | PLASTIC/EPOXY |
| Package Code | TBGA |
| Package Equivalence Code | BGA144,12X18,40/32 |
| Package Shape | RECTANGULAR |
| Package Style | GRID ARRAY, THIN PROFILE |
| Peak Reflow Temperature (Cel) | 235 |
| Power Supplies | 1.5/1.8,1.8,2.5 |
| Qualification Status | Not Qualified |
| Seated Height-Max | 1.2 |
| Sequential Burst Length | 2,4,8 |
| Standby Current-Max | 0.048 |
| Sub Category | DRAMs |
| Supply Current-Max | 0.97 |
| Supply Voltage-Max (Vsup) | 1.9 |
| Supply Voltage-Min (Vsup) | 1.7 |
| Supply Voltage-Nom (Vsup) | 1.8 |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | OTHER |
| Terminal Finish | TIN LEAD SILVER |
| Terminal Form | BALL |
| Terminal Pitch | 1 |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Width | 11 |