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Learn more about ECAD Model here.Electrical Characteristics
| Access Time-Max | 8.5 |
| Additional Feature | FLOW-THROUGH ARCHITECTURE |
| JESD-30 Code | R-PQFP-G100 |
| JESD-609 Code | e0 |
| Length | 20 |
| Memory Density | 2097152 |
| Memory IC Type | CACHE SRAM |
| Memory Width | 32 |
| Moisture Sensitivity Level | 3 |
| Number of Functions | 1 |
| Number of Terminals | 100 |
| Number of Words | 65536 |
| Number of Words Code | 64K |
| Operating Mode | SYNCHRONOUS |
| Operating Temperature-Max | 70 |
| Operating Temperature-Min | 0 |
| Organization | 64KX32 |
| Package Body Material | PLASTIC/EPOXY |
| Package Code | LQFP |
| Package Shape | RECTANGULAR |
| Package Style | FLATPACK, LOW PROFILE |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Cel) | 225 |
| Qualification Status | Not Qualified |
| Seated Height-Max | 1.6 |
| Supply Voltage-Max (Vsup) | 3.6 |
| Supply Voltage-Min (Vsup) | 3.135 |
| Supply Voltage-Nom (Vsup) | 3.3 |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | COMMERCIAL |
| Terminal Finish | TIN LEAD (800) |
| Terminal Form | GULL WING |
| Terminal Pitch | 0.65 |
| Terminal Position | QUAD |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Width | 14 |