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Learn more about ECAD Model here.Electrical Characteristics
Access Mode | FAST PAGE |
Access Time-Max | 60 |
Additional Feature | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
Alternate Memory Width | 16 |
I/O Type | COMMON |
JESD-30 Code | R-XSMA-N72 |
JESD-609 Code | e0 |
Memory Density | 33554432 |
Memory IC Type | FAST PAGE DRAM MODULE |
Memory Width | 32 |
Number of Functions | 1 |
Number of Ports | 1 |
Number of Terminals | 72 |
Number of Words | 1048576 |
Number of Words Code | 1M |
Operating Mode | ASYNCHRONOUS |
Operating Temperature-Max | 70 |
Operating Temperature-Min | 0 |
Organization | 1MX32 |
Output Characteristics | 3-STATE |
Package Body Material | UNSPECIFIED |
Package Code | SIMM |
Package Equivalence Code | SSIM72 |
Package Shape | RECTANGULAR |
Package Style | MICROELECTRONIC ASSEMBLY |
Peak Reflow Temperature (Cel) | 235 |
Power Supplies | 5 |
Qualification Status | Not Qualified |
Refresh Cycles | 1024 |
Seated Height-Max | 25.654 |
Self Refresh | NO |
Standby Current-Max | 0.008 |
Sub Category | DRAMs |
Supply Current-Max | 0.88 |
Supply Voltage-Max (Vsup) | 5.5 |
Supply Voltage-Min (Vsup) | 4.5 |
Supply Voltage-Nom (Vsup) | 5 |
Surface Mount | NO |
Technology | CMOS |
Temperature Grade | COMMERCIAL |
Terminal Finish | TIN LEAD |
Terminal Form | NO LEAD |
Terminal Pitch | 1.27 |
Terminal Position | SINGLE |
Time@Peak Reflow Temperature-Max (s) | 30 |