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Learn more about ECAD Model here.Electrical Characteristics
| Access Time-Max | 0.45 |
| Clock Frequency-Max (fCLK) | 333 |
| I/O Type | COMMON |
| JESD-30 Code | R-PDMA-N244 |
| JESD-609 Code | e3 |
| Memory Density | 4831838208 |
| Memory IC Type | DDR DRAM MODULE |
| Memory Width | 72 |
| Moisture Sensitivity Level | 1 |
| Number of Terminals | 244 |
| Number of Words | 67108864 |
| Number of Words Code | 64M |
| Operating Temperature-Max | 70 |
| Operating Temperature-Min | 0 |
| Organization | 64MX72 |
| Output Characteristics | 3-STATE |
| Package Body Material | PLASTIC/EPOXY |
| Package Code | DIMM |
| Package Equivalence Code | DIMM244,24 |
| Package Shape | RECTANGULAR |
| Package Style | MICROELECTRONIC ASSEMBLY |
| Peak Reflow Temperature (Cel) | 260 |
| Power Supplies | 1.8 |
| Qualification Status | Not Qualified |
| Refresh Cycles | 8192 |
| Standby Current-Max | 0.063 |
| Sub Category | DRAMs |
| Supply Current-Max | 1.26 |
| Supply Voltage-Nom (Vsup) | 1.8 |
| Surface Mount | NO |
| Technology | CMOS |
| Temperature Grade | COMMERCIAL |
| Terminal Finish | MATTE TIN |
| Terminal Form | NO LEAD |
| Terminal Pitch | 0.6 |
| Terminal Position | DUAL |
| Time@Peak Reflow Temperature-Max (s) | 30 |