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Ordering Info
In Stock: 0
MOQ: 1
Package Quantity: 1
*Product Country of Origin (COO) information may be unavailable at the time of order placement. Buyer acknowledges that additional duties, tariffs, or import fees may be assessed based on the actual COO once determined.
| Quantity | Cost |
|---|---|
| 1 | - |
Electrical Characteristics
| Additional Feature | LVTTL, LVCMOS, HSTL, CML OR LVDS TO LVNECL TRANSLATION ALSO POSSIBLE |
| Delay-Max | 0.65 |
| Interface IC Type | PECL TO ECL TRANSLATOR |
| JESD-30 Code | S-XQCC-N24 |
| JESD-609 Code | e3 |
| Length | 4 |
| Moisture Sensitivity Level | 1 |
| Negative Supply Voltage-Nom | -2.5 |
| Number of Bits | 1 |
| Number of Functions | 1 |
| Number of Terminals | 24 |
| Operating Temperature-Max | 85 |
| Operating Temperature-Min | -40 |
| Output Latch or Register | NONE |
| Output Polarity | COMPLEMENTARY |
| Package Body Material | UNSPECIFIED |
| Package Code | HVQCCN |
| Package Shape | SQUARE |
| Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| Peak Reflow Temperature (Cel) | 260 |
| Qualification Status | Not Qualified |
| Seated Height-Max | 1 |
| Supply Voltage-Max | 3.8 |
| Supply Voltage-Min | 2.375 |
| Supply Voltage-Nom | 2.5 |
| Surface Mount | YES |
| Technology | ECL |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | Tin (Sn) |
| Terminal Form | NO LEAD |
| Terminal Pitch | 0.5 |
| Terminal Position | QUAD |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Width | 4 |