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Learn more about ECAD Model here.Electrical Characteristics
| Additional Feature | LVTTL, LVCMOS, HSTL, CML OR LVDS TO LVNECL TRANSLATION ALSO POSSIBLE |
| Delay-Max | 0.65 |
| Interface IC Type | PECL TO ECL TRANSLATOR |
| JESD-30 Code | S-XQCC-N24 |
| JESD-609 Code | e3 |
| Length | 4 |
| Moisture Sensitivity Level | 1 |
| Negative Supply Voltage-Nom | -2.5 |
| Number of Bits | 1 |
| Number of Functions | 1 |
| Number of Terminals | 24 |
| Operating Temperature-Max | 85 |
| Operating Temperature-Min | -40 |
| Output Latch or Register | NONE |
| Output Polarity | COMPLEMENTARY |
| Package Body Material | UNSPECIFIED |
| Package Code | HVQCCN |
| Package Shape | SQUARE |
| Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| Peak Reflow Temperature (Cel) | 260 |
| Qualification Status | Not Qualified |
| Seated Height-Max | 1 |
| Supply Voltage-Max | 3.8 |
| Supply Voltage-Min | 2.375 |
| Supply Voltage-Nom | 2.5 |
| Surface Mount | YES |
| Technology | ECL |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | Tin (Sn) |
| Terminal Form | NO LEAD |
| Terminal Pitch | 0.5 |
| Terminal Position | QUAD |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Width | 4 |