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Learn more about ECAD Model here.Electrical Characteristics
Address Bus Width | 26 |
Bit Size | 32 |
Boundary Scan | YES |
Clock Frequency-Max | 59 |
External Data Bus Width | 16 |
Format | FLOATING POINT |
Integrated Cache | YES |
JESD-30 Code | S-PBGA-B515 |
JESD-609 Code | e1 |
Length | 12 |
Low Power Mode | YES |
Moisture Sensitivity Level | 3 |
Number of Terminals | 515 |
Operating Temperature-Max | 85 |
Operating Temperature-Min | -40 |
Package Body Material | PLASTIC/EPOXY |
Package Code | VFBGA |
Package Equivalence Code | BGA515,28X28,16 |
Package Shape | SQUARE |
Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
Peak Reflow Temperature (Cel) | 260 |
Power Supplies | 1.1,1.8,3.3 |
Qualification Status | Not Qualified |
Seated Height-Max | 0.9 |
Speed | 600 |
Sub Category | Graphics Processors |
Supply Voltage-Max | 1.89 |
Supply Voltage-Min | 1.71 |
Supply Voltage-Nom | 1.8 |
Surface Mount | YES |
Technology | CMOS |
Temperature Grade | INDUSTRIAL |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
Terminal Form | BALL |
Terminal Pitch | 0.4 |
Terminal Position | BOTTOM |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Width | 12 |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |