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Electrical Characteristics
| Address Bus Width | 0 |
| Bit Size | 32 |
| Boundary Scan | YES |
| Clock Frequency-Max | 100 |
| External Data Bus Width | 0 |
| Format | FLOATING POINT |
| Integrated Cache | YES |
| JESD-30 Code | S-PBGA-B689 |
| JESD-609 Code | e2 |
| Length | 31 |
| Low Power Mode | YES |
| Moisture Sensitivity Level | 3 |
| Number of Terminals | 689 |
| Operating Temperature-Max | 125 |
| Operating Temperature-Min | 0 |
| Package Body Material | PLASTIC/EPOXY |
| Package Code | HBGA |
| Package Shape | SQUARE |
| Package Style | GRID ARRAY, HEAT SINK/SLUG |
| Peak Reflow Temperature (Cel) | 260 |
| Seated Height-Max | 2.46 |
| Speed | 533 |
| Supply Voltage-Max | 1.05 |
| Supply Voltage-Min | 0.95 |
| Supply Voltage-Nom | 1 |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | OTHER |
| Terminal Finish | TIN COPPER/TIN SILVER |
| Terminal Form | BALL |
| Terminal Pitch | 1 |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Width | 31 |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |