Request Quote
Request Quote
Thank you for your inquiry. We are working on your request and will respond as soon as possible. For immediate inquiries please call 1-866-651-2901
Download the free Library Loader to convert this file for your ECAD Tool.
Learn more about ECAD Model here.Electrical Characteristics
Address Bus Width | 0 |
Bit Size | 32 |
Boundary Scan | YES |
Clock Frequency-Max | 100 |
External Data Bus Width | 0 |
Format | FIXED POINT |
Integrated Cache | YES |
JESD-30 Code | S-PBGA-B689 |
Length | 31 |
Low Power Mode | YES |
Moisture Sensitivity Level | 3 |
Number of Terminals | 689 |
Package Body Material | PLASTIC/EPOXY |
Package Code | HBGA |
Package Equivalence Code | BGA689,29X29,40 |
Package Shape | SQUARE |
Package Style | GRID ARRAY, HEAT SINK/SLUG |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Power Supplies | 1 |
Qualification Status | Not Qualified |
Seated Height-Max | 2.46 |
Speed | 800 |
Sub Category | Microprocessors |
Supply Voltage-Max | 1.05 |
Supply Voltage-Min | 0.95 |
Supply Voltage-Nom | 1 |
Surface Mount | YES |
Technology | CMOS |
Terminal Form | BALL |
Terminal Pitch | 1 |
Terminal Position | BOTTOM |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Width | 31 |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |