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Learn more about ECAD Model here.Electrical Characteristics
Access Time-Max | 88 |
Additional Feature | SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE |
Boot Block | BOTTOM |
Command User Interface | YES |
Common Flash Interface | YES |
Data Polling | NO |
JESD-30 Code | R-PBGA-B64 |
Length | 13 |
Memory Density | 268435456 |
Memory IC Type | FLASH |
Memory Width | 16 |
Number of Functions | 1 |
Number of Sectors/Size | 4255 |
Number of Terminals | 64 |
Number of Words | 16777216 |
Number of Words Code | 16M |
Operating Mode | ASYNCHRONOUS |
Operating Temperature-Max | 85 |
Operating Temperature-Min | -40 |
Organization | 16MX16 |
Package Body Material | PLASTIC/EPOXY |
Package Code | TBGA |
Package Equivalence Code | BGA64,8X8,40 |
Package Shape | RECTANGULAR |
Package Style | GRID ARRAY, THIN PROFILE |
Page Size | 4 |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Power Supplies | 1.8,1.8/3.3 |
Programming Voltage | 1.8 |
Qualification Status | Not Qualified |
Seated Height-Max | 1.2 |
Sector Size | 16K,64K |
Standby Current-Max | 0.000115 |
Sub Category | Flash Memories |
Supply Current-Max | 0.028 |
Supply Voltage-Max (Vsup) | 2 |
Supply Voltage-Min (Vsup) | 1.7 |
Supply Voltage-Nom (Vsup) | 1.8 |
Surface Mount | YES |
Technology | CMOS |
Temperature Grade | INDUSTRIAL |
Terminal Form | BALL |
Terminal Pitch | 1 |
Terminal Position | BOTTOM |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Toggle Bit | NO |
Type | NOR TYPE |
Width | 10 |