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Learn more about ECAD Model here.Electrical Characteristics
| Additional Feature | HIGH RELIABILITY |
| Case Connection | SOURCE |
| Configuration | SINGLE |
| DS Breakdown Voltage-Min | 65 |
| Drain Current-Max (Abs) (ID) | 2.5 |
| Drain Current-Max (ID) | 2.5 |
| FET Technology | METAL-OXIDE SEMICONDUCTOR |
| Highest Frequency Band | ULTRA HIGH FREQUENCY BAND |
| JESD-30 Code | R-PDSO-G2 |
| JESD-609 Code | e3 |
| Moisture Sensitivity Level | 3 |
| Number of Elements | 1 |
| Number of Terminals | 2 |
| Operating Mode | ENHANCEMENT MODE |
| Operating Temperature-Max | 165 |
| Package Body Material | PLASTIC/EPOXY |
| Package Shape | RECTANGULAR |
| Package Style | SMALL OUTLINE |
| Peak Reflow Temperature (Cel) | 250 |
| Polarity/Channel Type | N-CHANNEL |
| Power Dissipation-Max (Abs) | 31.7 |
| Qualification Status | Not Qualified |
| Sub Category | FET General Purpose Power |
| Surface Mount | YES |
| Terminal Finish | Matte Tin (Sn) - annealed |
| Terminal Form | GULL WING |
| Terminal Position | DUAL |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Transistor Application | AMPLIFIER |
| Transistor Element Material | SILICON |