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Electrical Characteristics
| Access Time-Max | 100 |
| Boot Block | BOTTOM/TOP |
| Command User Interface | YES |
| Common Flash Interface | YES |
| Data Polling | NO |
| JESD-30 Code | R-PBGA-B88 |
| JESD-609 Code | e1 |
| Memory Density | 536870912 |
| Memory IC Type | FLASH |
| Memory Width | 16 |
| Number of Sectors/Size | 8, 510 |
| Number of Terminals | 88 |
| Number of Words | 33554432 |
| Number of Words Code | 32M |
| Operating Temperature-Max | 85 |
| Operating Temperature-Min | -40 |
| Organization | 32MX16 |
| Package Body Material | PLASTIC/EPOXY |
| Package Code | FBGA |
| Package Equivalence Code | BGA88,8X12,32 |
| Package Shape | RECTANGULAR |
| Package Style | GRID ARRAY, FINE PITCH |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Cel) | 260 |
| Power Supplies | 1.8,1.8/3.3 |
| Programming Voltage | 1.8 |
| Qualification Status | Not Qualified |
| Sector Size | 16K,64K |
| Standby Current-Max | 0.00042 |
| Sub Category | Flash Memories |
| Supply Current-Max | 0.031 |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | TIN SILVER COPPER |
| Terminal Form | BALL |
| Terminal Pitch | 0.8 |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Toggle Bit | NO |
| Type | NOR TYPE |