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Ordering Info
In Stock: 0
MOQ: 260
Package Quantity: 260
Subject to tariff fees.
*Product Country of Origin (COO) information may be unavailable at the time of order placement. Buyer acknowledges that additional duties, tariffs, or import fees may be assessed based on the actual COO once determined.
| Quantity | Cost |
|---|---|
| 260 | - |
Electrical Characteristics
| JESD-30 Code | S-PBGA-B84 |
| JESD-609 Code | e1 |
| Length | 9 |
| Moisture Sensitivity Level | 3 |
| Number of Functions | 1 |
| Number of Terminals | 84 |
| Operating Temperature-Max | 70 |
| Operating Temperature-Min | 0 |
| Package Body Material | PLASTIC/EPOXY |
| Package Code | LFBGA |
| Package Shape | SQUARE |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH |
| Peak Reflow Temperature (Cel) | 260 |
| Qualification Status | Not Qualified |
| Seated Height-Max | 1.46 |
| Supply Voltage-Nom | 1.8 |
| Surface Mount | YES |
| Telecom IC Type | TELECOM CIRCUIT |
| Temperature Grade | COMMERCIAL |
| Terminal Finish | TIN SILVER COPPER |
| Terminal Form | BALL |
| Terminal Pitch | .8 |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Width | 9 |