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Electrical Characteristics
| JESD-30 Code | S-PBGA-B84 |
| JESD-609 Code | e1 |
| Length | 9 |
| Moisture Sensitivity Level | 3 |
| Number of Functions | 1 |
| Number of Terminals | 84 |
| Operating Temperature-Max | 70 |
| Operating Temperature-Min | 0 |
| Package Body Material | PLASTIC/EPOXY |
| Package Code | LFBGA |
| Package Shape | SQUARE |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH |
| Peak Reflow Temperature (Cel) | 260 |
| Qualification Status | Not Qualified |
| Seated Height-Max | 1.46 |
| Supply Voltage-Nom | 1.8 |
| Surface Mount | YES |
| Telecom IC Type | TELECOM CIRCUIT |
| Temperature Grade | COMMERCIAL |
| Terminal Finish | TIN SILVER COPPER |
| Terminal Form | BALL |
| Terminal Pitch | .8 |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Width | 9 |