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Learn more about ECAD Model here.Electrical Characteristics
Access Time-Max | 150 |
Additional Feature | 00.1.142 |
Alternate Memory Width | 8 |
Command User Interface | YES |
Common Flash Interface | YES |
Data Polling | NO |
JESD-30 Code | R-PBGA-B64 |
Length | 13 |
Memory Density | 134217728 |
Memory IC Type | FLASH |
Memory Width | 16 |
Number of Functions | 1 |
Number of Sectors/Size | 128 |
Number of Terminals | 64 |
Number of Words | 8388608 |
Number of Words Code | 8M |
Operating Mode | ASYNCHRONOUS |
Operating Temperature-Max | 85 |
Operating Temperature-Min | -40 |
Organization | 8MX16 |
Package Body Material | PLASTIC/EPOXY |
Package Code | TBGA |
Package Equivalence Code | BGA64,8X8,40 |
Package Shape | RECTANGULAR |
Package Style | GRID ARRAY, THIN PROFILE |
Page Size | 42833 |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Power Supplies | 3/3.3 |
Programming Voltage | 2.7 |
Qualification Status | Not Qualified |
Ready/Busy | YES |
Seated Height-Max | 1.2 |
Sector Size | 128K |
Standby Current-Max | 0.00012 |
Sub Category | Flash Memories |
Supply Current-Max | 0.08 |
Supply Voltage-Max (Vsup) | 3.6 |
Supply Voltage-Min (Vsup) | 2.7 |
Supply Voltage-Nom (Vsup) | 3 |
Surface Mount | YES |
Technology | CMOS |
Temperature Grade | INDUSTRIAL |
Terminal Form | BALL |
Terminal Pitch | 1 |
Terminal Position | BOTTOM |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Toggle Bit | NO |
Type | NOR TYPE |
Width | 10 |