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Ordering Info
In Stock: 0
MOQ: 180
Package Quantity: 180
HTS Code: 8542.32.00
COO: US
*Product Country of Origin (COO) information may be unavailable at the time of order placement. Buyer acknowledges that additional duties, tariffs, or import fees may be assessed based on the actual COO once determined.
| Quantity | Cost |
|---|---|
| 180 | - |
Electrical Characteristics
| Access Time-Max | 100 |
| Alternate Memory Width | 8 |
| Command User Interface | YES |
| Common Flash Interface | YES |
| Data Polling | YES |
| JESD-30 Code | R-PBGA-B64 |
| JESD-609 Code | e1 |
| Length | 13 |
| Memory Density | 268435456 |
| Memory IC Type | FLASH |
| Memory Width | 1 |
| Moisture Sensitivity Level | 3 |
| Number of Functions | 1 |
| Number of Sectors/Size | 256 |
| Number of Terminals | 64 |
| Number of Words | 268435456 |
| Number of Words Code | 256M |
| Operating Mode | ASYNCHRONOUS |
| Operating Temperature-Max | 85 |
| Operating Temperature-Min | -40 |
| Organization | 256MX1 |
| Package Body Material | PLASTIC/EPOXY |
| Package Code | LBGA |
| Package Equivalence Code | BGA64,8X8,40 |
| Package Shape | RECTANGULAR |
| Package Style | GRID ARRAY, LOW PROFILE |
| Page Size | 43328 |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Cel) | 260 |
| Power Supplies | 3/3.3 |
| Programming Voltage | 3 |
| Qualification Status | Not Qualified |
| Ready/Busy | YES |
| Seated Height-Max | 1.4 |
| Sector Size | 128K |
| Standby Current-Max | 5e-06 |
| Sub Category | Flash Memories |
| Supply Current-Max | 0.11 |
| Supply Voltage-Max (Vsup) | 3.6 |
| Supply Voltage-Min (Vsup) | 2.7 |
| Supply Voltage-Nom (Vsup) | 3 |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| Terminal Form | BALL |
| Terminal Pitch | 1 |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Toggle Bit | YES |
| Type | NOR TYPE |
| Width | 11 |