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Learn more about ECAD Model here.Electrical Characteristics
| Access Time-Max | 25 |
| Command User Interface | YES |
| Data Polling | NO |
| JESD-30 Code | R-PBGA-B63 |
| Length | 11 |
| Memory Density | 2147483648 |
| Memory IC Type | FLASH |
| Memory Width | 8 |
| Number of Functions | 1 |
| Number of Sectors/Size | 2K |
| Number of Terminals | 63 |
| Number of Words | 268435456 |
| Number of Words Code | 256M |
| Operating Mode | ASYNCHRONOUS |
| Operating Temperature-Max | 85 |
| Operating Temperature-Min | -40 |
| Organization | 256MX8 |
| Package Body Material | PLASTIC/EPOXY |
| Package Code | VFBGA |
| Package Equivalence Code | BGA63,10X12,32 |
| Package Shape | RECTANGULAR |
| Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| Page Size | 2K |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Power Supplies | 3/3.3 |
| Programming Voltage | 3 |
| Qualification Status | Not Qualified |
| Ready/Busy | YES |
| Seated Height-Max | 1 |
| Sector Size | 128K |
| Standby Current-Max | 5e-05 |
| Sub Category | Flash Memories |
| Supply Current-Max | 0.03 |
| Supply Voltage-Max (Vsup) | 3.6 |
| Supply Voltage-Min (Vsup) | 2.7 |
| Supply Voltage-Nom (Vsup) | 3.3 |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Form | BALL |
| Terminal Pitch | 0.8 |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Toggle Bit | NO |
| Type | NAND TYPE |
| Width | 9 |