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Ordering Info
In Stock: 0
MOQ: 2300
Package Quantity: 2300
*Product Country of Origin (COO) information may be unavailable at the time of order placement. Buyer acknowledges that additional duties, tariffs, or import fees may be assessed based on the actual COO once determined.
| Quantity | Cost |
|---|---|
| 2300 | - |
Electrical Characteristics
| JESD-30 Code | R-PBGA-B63 |
| Length | 11 |
| Memory Density | 8589934592 |
| Memory IC Type | FLASH |
| Memory Width | 8 |
| Number of Functions | 1 |
| Number of Terminals | 63 |
| Number of Words | 1073741824 |
| Number of Words Code | 1G |
| Operating Mode | ASYNCHRONOUS |
| Operating Temperature-Max | 105 |
| Operating Temperature-Min | -40 |
| Organization | 1GX8 |
| Package Body Material | PLASTIC/EPOXY |
| Package Code | VFBGA |
| Package Shape | RECTANGULAR |
| Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| Parallel/Serial | PARALLEL |
| Programming Voltage | 3 |
| Seated Height-Max | 1 |
| Supply Voltage-Max (Vsup) | 3.6 |
| Supply Voltage-Min (Vsup) | 2.7 |
| Supply Voltage-Nom (Vsup) | 3 |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Form | BALL |
| Terminal Pitch | 0.8 |
| Terminal Position | BOTTOM |
| Width | 9 |