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Learn more about ECAD Model here.Electrical Characteristics
| Address Bus Width | 3 |
| Boundary Scan | NO |
| Clock Frequency-Max | 4 |
| Communication Protocol | ASYNC, BIT |
| Data Encoding/Decoding Method | NRZ |
| Data Transfer Rate-Max | 0.0046875 |
| External Data Bus Width | 8 |
| JESD-30 Code | R-PDIP-T24 |
| JESD-609 Code | e3 |
| Length | 31.7 |
| Low Power Mode | YES |
| Moisture Sensitivity Level | NOT APPLICABLE |
| Number of DMA Channels | 0 |
| Number of I/O Lines | 1 |
| Number of Serial I/Os | 1 |
| Number of Terminals | 24 |
| On Chip Data RAM Width | 0 |
| Operating Temperature-Max | 70 |
| Operating Temperature-Min | 0 |
| Package Body Material | PLASTIC/EPOXY |
| Package Code | DIP |
| Package Equivalence Code | DIP24,.3 |
| Package Shape | RECTANGULAR |
| Package Style | IN-LINE |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Power Supplies | 5 |
| Qualification Status | Not Qualified |
| RAM (words) | 0 |
| Seated Height-Max | 4.7 |
| Sub Category | Serial IO/Communication Controllers |
| Supply Current-Max | 2 |
| Supply Voltage-Max | 5.5 |
| Supply Voltage-Min | 4.5 |
| Supply Voltage-Nom | 5 |
| Surface Mount | NO |
| Technology | CMOS |
| Temperature Grade | COMMERCIAL |
| Terminal Finish | Tin (Sn) |
| Terminal Form | THROUGH-HOLE |
| Terminal Pitch | 2.54 |
| Terminal Position | DUAL |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Width | 7.62 |
| uPs/uCs/Peripheral ICs Type | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |