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Learn more about ECAD Model here.Electrical Characteristics
| Address Bus Width | 6 |
| Boundary Scan | NO |
| Clock Frequency-Max | 4 |
| Communication Protocol | ASYNC, BIT |
| Data Encoding/Decoding Method | NRZ |
| Data Transfer Rate-Max | 0.125 |
| External Data Bus Width | 8 |
| JESD-30 Code | S-PQCC-J84 |
| JESD-609 Code | e3 |
| Length | 29.31 |
| Low Power Mode | YES |
| Moisture Sensitivity Level | 3 |
| Number of DMA Channels | 0 |
| Number of I/O Lines | 0 |
| Number of Serial I/Os | 8 |
| Number of Terminals | 84 |
| On Chip Data RAM Width | 0 |
| Operating Temperature-Max | 70 |
| Operating Temperature-Min | 0 |
| Package Body Material | PLASTIC/EPOXY |
| Package Code | QCCJ |
| Package Equivalence Code | LDCC84,1.2SQ |
| Package Shape | SQUARE |
| Package Style | CHIP CARRIER |
| Peak Reflow Temperature (Cel) | 245 |
| Power Supplies | 5 |
| Qualification Status | Not Qualified |
| RAM (words) | 0 |
| Seated Height-Max | 4.57 |
| Sub Category | Serial IO/Communication Controllers |
| Supply Current-Max | 30 |
| Supply Voltage-Max | 5.25 |
| Supply Voltage-Min | 4.75 |
| Supply Voltage-Nom | 5 |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | COMMERCIAL |
| Terminal Finish | Tin (Sn) |
| Terminal Form | J BEND |
| Terminal Pitch | 1.27 |
| Terminal Position | QUAD |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Width | 29.31 |
| uPs/uCs/Peripheral ICs Type | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |