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Learn more about ECAD Model here.Electrical Characteristics
Access Time-Max | 13 |
Clock Frequency-Max (fCLK) | 50 |
Cycle Time | 20 |
JESD-30 Code | S-PQFP-G64 |
JESD-609 Code | e4 |
Length | 10 |
Memory Density | 18432 |
Memory IC Type | OTHER FIFO |
Memory Width | 9 |
Moisture Sensitivity Level | 3 |
Number of Functions | 1 |
Number of Terminals | 64 |
Number of Words | 2048 |
Number of Words Code | 2K |
Operating Mode | SYNCHRONOUS |
Operating Temperature-Max | 70 |
Operating Temperature-Min | 0 |
Organization | 2KX9 |
Output Characteristics | 3-STATE |
Output Enable | YES |
Package Body Material | PLASTIC/EPOXY |
Package Code | TFQFP |
Package Equivalence Code | TQFP64,.47SQ |
Package Shape | SQUARE |
Package Style | FLATPACK, THIN PROFILE, FINE PITCH |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Cel) | 260 |
Power Supplies | 5 |
Qualification Status | Not Qualified |
Seated Height-Max | 1.2 |
Standby Current-Max | 0.0004 |
Sub Category | FIFOs |
Supply Voltage-Max (Vsup) | 5.5 |
Supply Voltage-Min (Vsup) | 4.5 |
Supply Voltage-Nom (Vsup) | 5 |
Surface Mount | YES |
Technology | CMOS |
Temperature Grade | COMMERCIAL |
Terminal Finish | Nickel/Palladium/Gold (Ni/Pd/Au) |
Terminal Form | GULL WING |
Terminal Pitch | 0.5 |
Terminal Position | QUAD |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Width | 10 |