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Learn more about ECAD Model here.Electrical Characteristics
| Family | HC/UH |
| JESD-30 Code | R-PDIP-T14 |
| JESD-609 Code | e4 |
| Length | 19.305 |
| Load Capacitance (CL) | 50 |
| Logic IC Type | NAND GATE |
| Max I(ol) | 0.004 |
| Number of Functions | 4 |
| Number of Inputs | 2 |
| Number of Terminals | 14 |
| Operating Temperature-Max | 85 |
| Operating Temperature-Min | -40 |
| Package Body Material | PLASTIC/EPOXY |
| Package Code | DIP |
| Package Equivalence Code | DIP14,.3 |
| Package Shape | RECTANGULAR |
| Package Style | IN-LINE |
| Packing Method | TUBE |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Power Supplies | 43137 |
| Prop Delay@Nom-Sup | 31 |
| Propagation Delay (tpd) | 156 |
| Qualification Status | Not Qualified |
| Schmitt Trigger | YES |
| Seated Height-Max | 5.08 |
| Sub Category | Gates |
| Supply Voltage-Max (Vsup) | 6 |
| Supply Voltage-Min (Vsup) | 2 |
| Supply Voltage-Nom (Vsup) | 5 |
| Surface Mount | NO |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | Nickel/Palladium/Gold (Ni/Pd/Au) |
| Terminal Form | THROUGH-HOLE |
| Terminal Pitch | 2.54 |
| Terminal Position | DUAL |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Width | 7.62 |