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Ordering Info
In Stock: 0
MOQ: 3000
Package Quantity: 3000
*Product Country of Origin (COO) information may be unavailable at the time of order placement. Buyer acknowledges that additional duties, tariffs, or import fees may be assessed based on the actual COO once determined.
| Quantity | Cost |
|---|---|
| 3000 | - |
Electrical Characteristics
| Family | LVC/LCX/Z |
| JESD-30 Code | R-XBGA-B5 |
| JESD-609 Code | e1 |
| Length | 1.388 |
| Load/Preset Input | YES |
| Logic IC Type | BUFFER |
| Max I(ol) | 0.024 |
| Moisture Sensitivity Level | 1 |
| Number of Functions | 1 |
| Number of Inputs | 1 |
| Number of Terminals | 5 |
| Operating Temperature-Max | 85 |
| Operating Temperature-Min | -40 |
| Output Characteristics | OPEN-DRAIN |
| Package Body Material | UNSPECIFIED |
| Package Code | VFBGA |
| Package Equivalence Code | BGA6,2X3,20 |
| Package Shape | RECTANGULAR |
| Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| Packing Method | TAPE AND REEL |
| Peak Reflow Temperature (Cel) | 260 |
| Power Supplies | 3.3 |
| Propagation Delay (tpd) | 8.3 |
| Qualification Status | Not Qualified |
| Schmitt Trigger | NO |
| Seated Height-Max | 0.5 |
| Sub Category | Gates |
| Supply Voltage-Max (Vsup) | 5.5 |
| Supply Voltage-Min (Vsup) | 1.65 |
| Supply Voltage-Nom (Vsup) | 3.3 |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| Terminal Form | BALL |
| Terminal Pitch | 0.5 |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Width | 0.888 |