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Learn more about ECAD Model here.Electrical Characteristics
| Family | LVC/LCX/Z |
| JESD-30 Code | R-XBGA-B5 |
| JESD-609 Code | e1 |
| Length | 1.388 |
| Load/Preset Input | YES |
| Logic IC Type | BUFFER |
| Max I(ol) | 0.024 |
| Moisture Sensitivity Level | 1 |
| Number of Functions | 1 |
| Number of Inputs | 1 |
| Number of Terminals | 5 |
| Operating Temperature-Max | 85 |
| Operating Temperature-Min | -40 |
| Output Characteristics | OPEN-DRAIN |
| Package Body Material | UNSPECIFIED |
| Package Code | VFBGA |
| Package Equivalence Code | BGA6,2X3,20 |
| Package Shape | RECTANGULAR |
| Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| Packing Method | TAPE AND REEL |
| Peak Reflow Temperature (Cel) | 260 |
| Power Supplies | 3.3 |
| Propagation Delay (tpd) | 8.3 |
| Qualification Status | Not Qualified |
| Schmitt Trigger | NO |
| Seated Height-Max | 0.5 |
| Sub Category | Gates |
| Supply Voltage-Max (Vsup) | 5.5 |
| Supply Voltage-Min (Vsup) | 1.65 |
| Supply Voltage-Nom (Vsup) | 3.3 |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| Terminal Form | BALL |
| Terminal Pitch | 0.5 |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Width | 0.888 |