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Learn more about ECAD Model here.Electrical Characteristics
Family | LVC/LCX/Z |
JESD-30 Code | R-PBGA-B5 |
JESD-609 Code | e0 |
Length | 1.4 |
Load Capacitance (CL) | 50 |
Logic IC Type | AND GATE |
Max I(ol) | 0.024 |
Moisture Sensitivity Level | 1 |
Number of Functions | 1 |
Number of Inputs | 2 |
Number of Terminals | 5 |
Operating Temperature-Max | 85 |
Operating Temperature-Min | -40 |
Package Body Material | PLASTIC/EPOXY |
Package Code | VFBGA |
Package Equivalence Code | BGA5,2X3,20 |
Package Shape | RECTANGULAR |
Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
Packing Method | TAPE AND REEL |
Peak Reflow Temperature (Cel) | 260 |
Power Supplies | 3.3 |
Prop Delay@Nom-Sup | 4.5 |
Propagation Delay (tpd) | 8 |
Qualification Status | Not Qualified |
Schmitt Trigger | NO |
Seated Height-Max | 0.5 |
Sub Category | Gates |
Supply Voltage-Max (Vsup) | 5.5 |
Supply Voltage-Min (Vsup) | 1.65 |
Supply Voltage-Nom (Vsup) | 1.8 |
Surface Mount | YES |
Technology | CMOS |
Temperature Grade | INDUSTRIAL |
Terminal Finish | TIN LEAD |
Terminal Form | BALL |
Terminal Pitch | 0.5 |
Terminal Position | BOTTOM |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Width | 0.9 |