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Learn more about ECAD Model here.Electrical Characteristics
Additional Feature | ALSO REQUIRES 3.3V SUPPLY |
Address Bus Width | 32 |
Bit Size | 32 |
Boundary Scan | YES |
Clock Frequency-Max | 66 |
External Data Bus Width | 32 |
Format | FLOATING POINT |
Integrated Cache | YES |
JESD-30 Code | S-PBGA-B272 |
JESD-609 Code | e1 |
Length | 27 |
Low Power Mode | YES |
Moisture Sensitivity Level | 3 |
Number of Terminals | 272 |
Operating Temperature-Max | 85 |
Operating Temperature-Min | -40 |
Package Body Material | PLASTIC/EPOXY |
Package Code | BGA |
Package Equivalence Code | BGA272,20X20,50 |
Package Shape | SQUARE |
Package Style | GRID ARRAY |
Peak Reflow Temperature (Cel) | 260 |
Power Supplies | 1.5,3.3 |
Qualification Status | Not Qualified |
Screening Level | AEC-Q100 |
Seated Height-Max | 2.65 |
Speed | 400 |
Sub Category | Microprocessors |
Supply Voltage-Max | 1.58 |
Supply Voltage-Min | 1.42 |
Supply Voltage-Nom | 1.5 |
Surface Mount | YES |
Technology | CMOS |
Temperature Grade | INDUSTRIAL |
Terminal Finish | TIN SILVER COPPER |
Terminal Form | BALL |
Terminal Pitch | 1.27 |
Terminal Position | BOTTOM |
Time@Peak Reflow Temperature-Max (s) | 40 |
Width | 27 |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR |