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Learn more about ECAD Model here.Electrical Characteristics
Access Time-Max | 70 |
Additional Feature | BOTTOM BOOT BLOCK |
Boot Block | BOTTOM |
Command User Interface | YES |
Common Flash Interface | YES |
Data Polling | YES |
JESD-30 Code | R-PBGA-B48 |
JESD-609 Code | e1 |
Length | 10 |
Memory Density | 67108864 |
Memory IC Type | FLASH |
Memory Width | 16 |
Number of Functions | 1 |
Number of Sectors/Size | 2K |
Number of Terminals | 48 |
Number of Words | 4194304 |
Number of Words Code | 4M |
Operating Mode | ASYNCHRONOUS |
Operating Temperature-Max | 70 |
Operating Temperature-Min | 0 |
Organization | 4MX16 |
Package Body Material | PLASTIC/EPOXY |
Package Code | TFBGA |
Package Equivalence Code | BGA48,6X8,32 |
Package Shape | RECTANGULAR |
Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Cel) | 260 |
Power Supplies | 3/3.3 |
Programming Voltage | 2.7 |
Qualification Status | Not Qualified |
Seated Height-Max | 1.2 |
Sector Size | 2K |
Standby Current-Max | 2e-05 |
Sub Category | Flash Memories |
Supply Current-Max | 0.035 |
Supply Voltage-Max (Vsup) | 3.6 |
Supply Voltage-Min (Vsup) | 2.7 |
Supply Voltage-Nom (Vsup) | 3 |
Surface Mount | YES |
Technology | CMOS |
Temperature Grade | COMMERCIAL |
Terminal Finish | TIN SILVER COPPER |
Terminal Form | BALL |
Terminal Pitch | 0.8 |
Terminal Position | BOTTOM |
Time@Peak Reflow Temperature-Max (s) | 40 |
Toggle Bit | YES |
Type | NOR TYPE |
Width | 8 |