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Learn more about ECAD Model here.Electrical Characteristics
| Data Rate | 4.8 |
| JESD-30 Code | R-PDSO-G28 |
| JESD-609 Code | e3 |
| Length | 9.7 |
| Moisture Sensitivity Level | 3 |
| Number of Functions | 1 |
| Number of Terminals | 28 |
| Operating Temperature-Max | 85 |
| Operating Temperature-Min | -40 |
| Package Body Material | PLASTIC/EPOXY |
| Package Code | HTSSOP |
| Package Equivalence Code | TSSOP28,.25 |
| Package Shape | RECTANGULAR |
| Package Style | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Power Supplies | 5,9 |
| Qualification Status | Not Qualified |
| Seated Height-Max | 1.2 |
| Sub Category | Modems |
| Supply Voltage-Nom | 5 |
| Surface Mount | YES |
| Technology | BCDMOS |
| Telecom IC Type | MODEM |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | Matte Tin (Sn) - annealed |
| Terminal Form | GULL WING |
| Terminal Pitch | .65 |
| Terminal Position | DUAL |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Width | 4.4 |