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Learn more about ECAD Model here.Electrical Characteristics
| JESD-30 Code | S-PQFP-G64 |
| JESD-609 Code | e4 |
| Length | 10 |
| Moisture Sensitivity Level | 3 |
| Number of Functions | 1 |
| Number of Terminals | 64 |
| Operating Temperature-Max | 85 |
| Operating Temperature-Min | -40 |
| Package Body Material | PLASTIC/EPOXY |
| Package Code | HVFQFP |
| Package Equivalence Code | TQFP64,.47SQ |
| Package Shape | SQUARE |
| Package Style | FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH |
| Peak Reflow Temperature (Cel) | 260 |
| Power Supplies | 2.5 |
| Qualification Status | Not Qualified |
| Seated Height-Max | 1 |
| Sub Category | Other Telecom ICs |
| Supply Voltage-Nom | 2.5 |
| Surface Mount | YES |
| Technology | TTL |
| Telecom IC Type | TELECOM CIRCUIT |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | Nickel/Palladium/Gold (Ni/Pd/Au) |
| Terminal Form | GULL WING |
| Terminal Pitch | 0.5 |
| Terminal Position | QUAD |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Width | 10 |