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TMMDB3 | ST MICROELECTRONICS

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ST MICROELECTRONICS TMMDB3

MINIMELF(CB465/MINIMELF DIAC T&


Ordering Info

In Stock: 0

Package Quantity: 2500

COO: CN

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Quantity Cost
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Electrical Characteristics

Breakover Voltage-Max 36
Breakover Voltage-Min 28
Case Connection ISOLATED
Configuration SINGLE
JESD-30 Code O-LELF-R2
JESD-609 Code e3
Moisture Sensitivity Level 1
Number of Elements 1
Number of Terminals 2
Operating Temperature-Max 125
Operating Temperature-Min -40
Package Body Material GLASS
Package Shape ROUND
Package Style LONG FORM
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Sub Category Silicon Surge Protectors
Surface Mount YES
Terminal Finish Matte Tin (Sn) - annealed
Terminal Form WRAP AROUND
Terminal Position END
Time@Peak Reflow Temperature-Max (s) 30
Trigger Device Type DIAC